100G QSFP28 passive DAC cable for short-distance data center interconnects.
When high-speed interconnect costs escalate in dense AI clusters, passive copper cabling provides a reliable alternative to optical modules. The QSFP28-DAC-3M passive copper cable addresses this by delivering 100Gb/s throughput for short-reach deployments without active component overhead.
Supporting data rates up to 100Gb/s per IEEE802.3bj, this DAC assembly ensures signal integrity with 100-ohm differential impedance and enhanced EMI design. With power consumption under 4mA at 3.3V, it eliminates thermal concerns in high-density switch environments while maintaining backward compatibility with lower-rate applications.
Ideal for adjacent cabinet connections in data centers, this QSFP28 cable meets Infiniband EDR specifications for storage and compute fabrics. It offers a maintenance-free, RoHS-compliant solution that reduces total cost of ownership compared to active optical alternatives.
Supports data transfer rates up to 100Gb/s compliant with IEEE802.3bj standard.
Passive copper design consumes less than 4mA current at 3.3V supply.
Engineered with improved electromagnetic interference shielding for signal integrity.
Supports hot-plug capability for easy installation and maintenance in live systems.
Compatible with QSFP28 MSA and Infiniband EDR specifications.
Complete technical details for integration and deployment planning.
| Product Type | Direct Attach Passive Copper Cable |
|---|---|
| Connector Type | QSFP28 |
| Cable Length | 3 meters |
| Data Rate | Up to 100Gb/s |
|---|---|
| Bit Error Rate | 10^-12 |
| Impedance | 100 ohm differential |
| Protocol Support | IEEE802.3bj, Infiniband EDR, QSFP28 MSA |
|---|
| Supply Voltage | 3.14V to 3.46V (Typical 3.30V) |
|---|---|
| Supply Current | Max 4 mA |
| Operating Case Temperature | 0°C to +70°C |
|---|---|
| Storage Temperature | -40°C to +85°C |
| Compliance | RoHS, EN 60825-1 Class 1 Laser, FDA 21 CFR 1040.10/1040.11 |
| Feature Support (Yes) | Hot Pluggable, AC Coupled Input/Output, Enhanced EMI Design |
|---|
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