From wafer dicing to die attach, wire bonding and final test, IC packaging & testing runs on vision systems that inspect every joint and surface. Gigabit multi-port NICs are the quiet workhorse behind those stations.
Wafer dicing needs alignment vision to cut along scribe lines. Die attach uses vision to place chips with micron accuracy. Wire bonding inspects each bond for broken, sagging or bridged wires. Final test scans for chip contamination, scratches and edge chipping. Every station has at least one camera, most have several — and all of them need reliable, low-cost image acquisition.
Packaging stations typically run 1-megapixel to 5-megapixel cameras at moderate frame rates — comfortably within gigabit bandwidth per port. Multi-port cards let one NIC serve several cameras or several stations from a single slot, expanding I/O without adding hosts. Simple cabling and fewer components keep the packaging line easy to maintain and quick to deploy.
Packaging floors are full of vibration, heat and EMC noise from molding presses and test handlers. NICs for this environment need stable, well-tested controllers, robust PCB design and consistent performance under sustained load. LR-LINK cards in this line use production-proven controllers (Intel, Realtek, AQC) with jumbo frame support and are validated for 24/7 operation.
Most packaging vision fits 1G; stations with higher-resolution or faster cameras step up to 2.5G (PoE+ frame grabbers) or 5G. The ladder keeps bandwidth and cost balanced: buy only what each station needs, and standardize cabling and software across the line.
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Sizing NICs for a packaging line? Send us your station list and camera specs — we will map the right card to each station and arrange samples.