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Semiconductor Industry · Solutions

Semiconductor Networking Solutions

Q: How do I balance 2.5G, 5G and 10G bandwidth against cost?

First calculate total camera throughput (resolution x frame rate x bit depth) and plan for 70% of theoretical bandwidth as headroom: a single camera at gigabit rates fits 1G/2.5G; mainstream 5-megapixel multi-camera setups choose 5G; high-resolution, high-frame-rate multi-camera concurrency chooses 10G.

Four purpose-built solutions for semiconductor manufacturing — lithography data transfer, wafer inspection GigE and USB camera capture, and IC packaging & testing. Frame grabber and data transfer NICs from 1G to 200G, frame-loss-free with RDMA.

Request Free Trial View Product Selection Table

Application Scenarios

1G–200G

Full Rate Coverage

RDMA

Ultra-Low Latency

Solutions Overview

Four Semiconductor Application Solutions

From wafer fabrication to packaging and testing — data transfer and vision inspection for the entire semiconductor production line

Solution 01

Lithography Data Transfer

2×100G fiber NIC + RDMA builds a high-speed channel for mask layout data to the lithography machine, ensuring precise pattern transfer to the wafer with low latency.

High Speed · Fiber · RDMA

Solution 02

Wafer Inspection — GigE Camera Capture

Frame grabber cards connect directly to GigE cameras. Jumbo frame + RDMA deliver frame-loss-free wafer defect and critical dimension inspection.

Frame-Loss-Free · With LR-LINK

Solution 03

Wafer Inspection — USB Camera Capture

USB frame grabber cards with multi-port independent bandwidth: plug-and-play, best total cost of ownership, cameras never contend with each other.

Independent Bandwidth · Reliable

Solution 04

IC Packaging & Testing

Vision positioning and defect inspection for wafer dicing, die attach, wire bonding and final test. Gigabit rates, multi-port expansion, simple cabling.

Gigabit-Based · Multi-Port

Solution 01

Lithography Data Transfer Solution

In lithography, mask layout data must travel at high speed between the lithography machine, storage servers and AI servers. A 2×100G fiber NIC with RDMA technology builds a high-reliability, ultra-stable data transfer system.

High-Speed Data Transfer Solution

The NIC provides a high-speed channel for mask layout data to the lithography machine, ensuring precise pattern transfer to the wafer with lower latency.

Highlights

High rates, fiber interfaces and RDMA; the NIC connects FPGA boards or switches.

Official Product Selection

25G Dual-Port Fiber NICLRES1021PF-2SFP28 25G Dual-Port RDMA Smart NICLRES1026PF-2SFP28 100G Dual-Port RDMA Smart NICLRES1046PF-2QSFP28 200G Dual-Port RDMA NICLRES1160PF-2QSFP56

Covers 25G / 100G / 200G fiber tiers (Intel E810 and more), RDMA supported. Click a model for details.

Solution 02

Wafer Inspection GigE Camera Capture Solution

Frame grabber cards connect directly to GigE cameras. Jumbo frame and RDMA features, compatible with mainstream industrial cameras and software, deliver short development cycles and frame-loss-free wafer defect and critical dimension measurement.

Wafer Inspection Solution

Wafer defect and critical dimension measurement with zero frame loss; the NIC connects directly to GigE cameras — shortest link, fewest failure points.

Highlights

Jumbo frame, RDMA, stability and reliability; NIC connects directly to GigE cameras. Speeds from 1G/2.5G/5G to 10G can be matched to balance bandwidth and cost.

Official Product Selection

2.5G Quad-Port PoE+ Frame GrabberLRES2058PT-POE 5G Quad-Port PoE+ Network AdapterLRES2680PT-POE Quad-Port PoE Frame GrabberLRES2049PT-POE 10G Quad-Port AdapterLRES1013PT

Tiers from 1G / 2.5G / 5G to 10G (quad/1G dual-port PoE in production). RDMA frame grabbers in development. Click a model for details.

Solution 03

Wafer Inspection USB Camera Capture Solution

USB frame grabber cards connect directly to USB cameras. Multi-port independent bandwidth means cameras never contend; cameras and accessories are easy to source at controlled cost; no complex network configuration — true plug-and-play.

Wafer Inspection Solution

Wafer defect and critical dimension measurement with zero frame loss; best total cost of ownership for concentrated, multi-camera workstations.

Highlights

Short transmission distance, multi-port, independent bandwidth; NIC connects directly to USB cameras with best total cost of ownership.

Selection Tiers

5G USB Frame Grabber2/4/8-port 10G USB Frame Grabber2/4-port 20G USB Frame GrabberIn development

USB frame grabbers (5G/10G/20G tiers) are being released progressively; this page will be updated as products launch.

IC packaging and testing solution architecture

Solution 04

IC Packaging & Testing Solution

Covers vision positioning and defect inspection for wafer dicing, die attach, wire bonding and final test. Gigabit-rate speeds, multi-port expansion, simple cabling and high stability deliver flexible deployment.

IC Packaging & Testing Solution

Vision positioning and defect inspection across wafer dicing, die attach, wire bonding and final test.

Highlights

Gigabit-rate speeds, multi-port expansion, simple cabling and high stability; ideal for detecting broken, sagging or bridged bonding wires, and chip contamination, scratches and edge chipping.

Official Product Selection

2.5G Quad-Port PoE+ Frame GrabberLRES2058PT-POE 5G Quad-Port PoE+ Network AdapterLRES2680PT-POE Quad-Port Gigabit NICLRES2046PT Quad-Port PoE Frame GrabberLRES2049PT-POE

Tiers from 1G / 2.5G / 5G with multi-port expansion and simple cabling (domestic 1G quad-port PoE in production). Click a model for details.

Product Selection

Semiconductor Product Selection Table

Full range of frame capture and data transfer cards — select by process requirement

Category	Rate	Frame Capture		Data Transfer	Official Product
Category	Rate	RJ45 Copper	USB	Data Transfer	Official Product
Frame Capture	1G	1/2/4/6/8×RJ45 (Intel I350 / I210)In Production1/2/4/8×RJ45 PoE (Intel I350 / I210)In Production4×M12 PoE (Intel I350)In Production	—	—	LRES2049PT-POE (quad-port PoE, domestic)LRES2054PT-POE (dual-port PoE+)
	2.5G	1/4×RJ45 (Intel I225 / I226 / RTL8125)In Production4×RJ45 PoE (Intel I226)In Production	—	—	LRES2058PT-POE (2.5G PoE)
	5G	4×RJ45 / 4×RJ45 PoE (AQC114)In Production4×RJ45 PoE (RTL8126 / AQC111)In Production	USB 3.0 5Gbps: 2-port USB-C, 4/8-port USB-A (Renesas)In Production	—	LRES2680PT-POE (5G PoE)LRSU9A72-2C (2-port USB-C)LRSU9A71-4A (4-port USB-A)LRSU9A72-8A (8-port USB-A)
	10G	1/4×RJ45 (AQC113)In Production2×RJ45 (AQC107)In Production4×RJ45 / 4×RJ45 PoEIn Production4×RJ45 (XILINX FPGA)In Production2×RJ45 / 2×RJ45 PoE (AQC113)In Production	USB 3.1 10Gbps: 2/4-port USB-A, dual-port USB-A+CIn Production	—	LRES1013PT (10G quad-port)LRSU3A42-2A (2-port USB-A)LRSU3A42-4A (4-port USB-A)LRSU9A42-AC (2-port: 1×USB-A + 1×USB-C)
	20G	—	8-channel 8-port 3U (Renesas)In Development8-channel 8-port (ASMedia)In Development	—	20G USB frame grabber — In Development
	USB frame grabbers: 5G tiers (2/4/8-port), 10G tiers (2/4-port) in production — 20G tiers in development. Register via the form for release notification; official links appear above as models go live.
Data Transfer	10G–200G Fiber	Dual-port 25G / 100G / 200G (imported controllers)In ProductionDual-port 25G / 100G / 200G (Broadcom)In ProductionDual/10G quad-port (Intel 700 series)In ProductionDual/25G quad-port, 100G dual-port (Intel E810 series)In Production	—	—	LRES1021PF-2SFP28 (25G dual-port E810)LRES1046PF-2QSFP28 (100G dual-port RDMA)LRES1160PF-2QSFP56 (200G dual-port RDMA)

Note: Products in development follow official release announcements. For end-of-life products, please consult us for replacement options.

Selection Guides

Semiconductor Selection Guides

In-depth guides written for this topic — process scenarios, product tiers and selection criteria

Lithography Data Transfer: How 2×100G Fiber NICs with RDMA Keep Mask Data Flowing

In semiconductor manufacturing, the lithography machine writes circuit patterns onto wafers — but on

Wafer Inspection GigE Frame Grabbers: Jumbo Frames, RDMA and Zero Frame Loss

Wafer defect detection and critical dimension measurement run on machine vision — and every dropped

USB Frame Grabbers for Wafer Inspection: Independent Bandwidth, Plug-and-Play, Lower TCO

When wafer inspection workstations are concentrated and camera counts are high, USB frame grabber ca

NIC Selection for IC Packaging & Testing: Gigabit Multi-Port Cards for Vision Inspection

From wafer dicing to die attach, wire bonding and final test, IC packaging & testing runs on vision

Service Process

Five-Step Service Process

Full-service support from requirements to after-sales

Requirements

Clarify process scenario, camera models and bandwidth needs

Solution Design

Match rate tiers and port configurations to the scenario

Sample Testing

Validate jumbo frame, RDMA and multi-camera concurrency on real hardware

Volume Supply

Multi-tier stocking on demand to keep production lines running

After-Sales

Dedicated NIC solution provider with ongoing technical support

Advantages

Why Choose LR-LINK

Professional NIC solution provider covering every semiconductor process scenario

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Full Process Coverage

From lithography data transfer and wafer inspection to IC packaging & testing — networking and frame capture solutions for the entire semiconductor manufacturing flow.

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Full Rate Tiers

1G to 200G with copper / USB / fiber form factors — balance bandwidth and cost flexibly; there is always a tier that fits your process.

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Mature Ecosystem, Proven Reliability

Compatible with mainstream industrial cameras and software with short development cycles; jumbo frame, RDMA and multi-port independent bandwidth guarantee frame-loss-free inspection.

FAQ

Frequently Asked Questions

Should I choose a GigE camera or USB camera solution for wafer inspection?

It depends on deployment and budget: choose GigE when transmission distance is long, complex networking is required, or jumbo frame / RDMA high bandwidth is needed; choose USB when workstations are concentrated, camera count is high, and lowest total cost with plug-and-play is preferred. Both deliver frame-loss-free inspection.

What practical value do jumbo frames and RDMA bring to wafer inspection?

Jumbo frames enlarge per-frame payload to cut frame processing overhead, raising image throughput at the same bandwidth. RDMA lets image data bypass the CPU and land directly in memory, lowering latency and CPU load while supporting concurrent multi-camera capture. Together they serve the hard requirement of zero frame loss. LR-LINK RDMA frame grabbers are currently in development.

How do I balance 2.5G, 5G and 10G bandwidth against cost?

First calculate total camera throughput (resolution × frame rate × bit depth) and plan for 70% of theoretical bandwidth as headroom: a single camera at gigabit rates fits 1G/2.5G; mainstream 5-megapixel multi-camera setups choose 5G; high-resolution, high-frame-rate multi-camera concurrency chooses 10G.

Why use fiber for lithography data transfer?

Mask layout data is huge and transmission spans workshop or even cross-plant distances. Fiber preserves signal integrity and resists electromagnetic interference far better than copper over long runs. Paired with a 2×100G fiber NIC and RDMA, it meets high-rate, low-latency, high-reliability requirements.

How should I understand "In Production" vs "In Development" in the selection table?

In Production products can be ordered normally. In Development products follow official release announcements — register your need via the form below and we will notify you first when released. For end-of-life products, please consult us for replacement options.

How do I scale a multi-camera setup with multi-port NICs?

Prefer multi-port frame grabber cards: each port carries independent bandwidth with no contention. Choose port count by summing camera bandwidth needs (e.g. 8-port 5G, 4-port 10G); add more cards when one card is not enough.

Contact Us

Ready to get started? Tell us about your semiconductor networking needs — our team will design the right solution for your process.

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